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First Generation In-house AI Chip Engineering Tape-out Successful
Investment Analysis 2021-03-28

First Generation In-house AI Chip Engineering Tape-out Successful

The company's first-generation in-house AI chip engineering tape-out was successful, marking a milestone breakthrough in the company's independent chip R&D field.

The chip uses advanced process technology, deeply optimized for AI inference and image processing scenarios, demonstrating excellent performance in internal testing. The chip has been used in some internal projects for inference acceleration and image processing verification.

The successful tape-out marks that the company has complete capabilities from chip design to tape-out verification, laying a solid foundation for subsequent chip mass production and productization.